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MAX14573EUD+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX14573EUD+ - Overvoltage & Overcurrent Protector, 4.5 V to 36 V in, TSSOP-14

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MAX14573EUD+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U14E+3
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MAX14573EUD+ - Analog Devices  - 3D model - Small Outline Packages - U14E+3
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MAX14573EUD+ Details

  • Manufacturer Part Number:

    MAX14573EUD+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    14-TSSOP_4.4_EP-4.4_MM

  • Package Description:

    5 X 6.50 MM, ROHS COMPLIANT, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4_EP-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2012-11-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.7 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX14573EUD+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14573EUD+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals to minimize noise and interference.
  • The MAX14573EUD+ has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour on the PCB can be used to connect the thermal pad to the thermal plane. Additionally, ensuring good airflow around the device and using a heat sink if necessary can help to reduce the junction temperature.
  • The recommended input voltage range for the MAX14573EUD+ is 2.7V to 5.5V. Operating the device outside of this range may affect its performance and reliability.
  • The MAX14573EUD+ can be configured for I2C or SPI interface by connecting the appropriate pins. For I2C interface, connect the SCL pin to the clock signal and the SDA pin to the data signal. For SPI interface, connect the SCK pin to the clock signal, the SDI pin to the data input signal, and the SDO pin to the data output signal.
  • The maximum data transfer rate of the MAX14573EUD+ is 1Mbps for I2C interface and 20Mbps for SPI interface.

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MAX14573EUD+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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