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MAX15462AATA+T - Analog Devices

Description: 42V, 300mA, Ultra-Small, High-Efficiency, Synchronous Step-Down DC-DC Converters

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MAX15462AATA+T - Analog Devices PCB footprint - Other - Other - MAX15462AATA+T
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MAX15462AATA+T Details

  • Manufacturer Part Number:

    MAX15462AATA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-LFCSP-2X2X0.75

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-LFCSP-2X2X0.75

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2015-06-04

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    PULSE FREQUENCY MODULATION TECHNIQUE ALSO AVAILABLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    S-XDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.3 A

  • Output Voltage-Max:

    5.25 V

  • Output Voltage-Min:

    4.75 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    4 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    535 kHz

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

MAX15462AATA+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX15462AATA+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 1uF to 10uF, while the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value between 1uF to 22uF. The capacitor selection should be based on the specific application requirements, such as output voltage ripple and transient response.
  • The MAX15462AATA+T has an operating ambient temperature range of -40°C to +125°C, but the maximum junction temperature should not exceed 150°C. The device should be derated for temperatures above 85°C to ensure reliable operation.
  • To ensure stability, the MAX15462AATA+T requires a minimum output capacitance of 1uF, and the output capacitor should be placed close to the device. Additionally, the input voltage should be well-regulated, and the device should be operated within its recommended operating conditions.
  • The typical startup time for the MAX15462AATA+T is around 1ms, but this can vary depending on the input voltage, output capacitance, and other application-specific factors.

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MAX15462AATA+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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