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MAX1617AMEE+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX1617AMEE+T - Temperature Sensor IC, SMBus Serial, Digital, ± 5°C, -55 °C, 125 °C, QSOP, 16 Pins

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MAX1617AMEE+T - Analog Devices - PCB symbol
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MAX1617AMEE+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - E16+1_DD
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MAX1617AMEE+T - Analog Devices - 3D model - Small Outline Packages - E16+1_DD
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MAX1617AMEE+T Details

  • Manufacturer Part Number:

    MAX1617AMEE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • Date Of Intro:

    1999-01-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Accuracy-Max (Cel):

    3 Cel

  • Body Breadth:

    3.9 mm

  • Body Height:

    1.75 mm

  • Body Length or Diameter:

    4.9 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    8

  • Number of Terminals:

    16

  • Operating Current-Max:

    0.12 mA

  • Operating Temperature-Max:

    85 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Termination Type:

    SOLDER

MAX1617AMEE+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX1617AMEE+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the battery or power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • The resistor values for the voltage divider network in the MAX1617AMEE+T should be chosen based on the desired voltage monitoring range and the desired accuracy. A good starting point is to use 1% or 0.1% tolerance resistors with values between 1kΩ and 100kΩ. The datasheet provides a formula to calculate the resistor values based on the desired voltage monitoring range.
  • The MAX1617AMEE+T can withstand up to 28V on its input pins, but it's recommended to limit the input voltage to the specified operating range of 2.7V to 5.5V to ensure accurate and reliable operation.
  • Hysteresis can be implemented in the MAX1617AMEE+T by adding an external hysteresis resistor (RHYST) between the output pin and the input pin. The value of RHYST should be chosen based on the desired hysteresis voltage and the output impedance of the device. A good starting point is to use a value between 1kΩ and 10kΩ.
  • The typical response time of the MAX1617AMEE+T to a voltage change on its input pins is around 10μs to 20μs, depending on the input voltage range and the output load. However, this can vary depending on the specific application and the PCB layout.

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MAX1617AMEE+T Overview

Use the download button to access the MAX1617AMEE+T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX16, or try a keyword search, such as Temperature Sensors

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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