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MAX17260SEWL+T - Analog Devices

Description: 5.1µA 1-Cell Fuel Gauge with ModelGauge m5 EZ and Optional High-Side Current Sensing

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MAX17260SEWL+T - Analog Devices - PCB symbol
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PCB Footprints
MAX17260SEWL+T - Analog Devices PCB footprint - BGA - BGA - W91G1+2
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3D Models
MAX17260SEWL+T - Analog Devices - 3D model - BGA - W91G1+2
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MAX17260SEWL+T Details

  • Manufacturer Part Number:

    MAX17260SEWL+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    9-WLCSP-N/A

  • Package Description:

    WLP-9

  • Pin Count:

    9

  • Manufacturer Package Code:

    9-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-06-21

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY GAUGE

  • JESD-30 Code:

    R-XBGA-B9

  • Length:

    1.468 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Current-Max (Isup):

    0.03 mA

  • Supply Voltage-Max (Vsup):

    4.9 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.448 mm

MAX17260SEWL+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX17260SEWL+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a separate power plane for the input voltage and to avoid routing high-frequency signals near the device.
  • The selection of input and output capacitors for the MAX17260SEWL+T depends on the specific application requirements. In general, X5R or X7R ceramic capacitors with a voltage rating of at least 2x the input voltage are recommended. The capacitance value should be chosen based on the desired output voltage ripple and transient response. A good starting point is to use 10uF to 22uF capacitors for both input and output.
  • The MAX17260SEWL+T has an operating temperature range of -40°C to +125°C. However, the device can be operated at a maximum ambient temperature of 105°C with a derated output current.
  • The MAX17260SEWL+T has a built-in OVP feature that can be enabled by connecting the OVP pin to a voltage source. The OVP threshold can be set by selecting the appropriate resistor value between the OVP pin and the input voltage. When the input voltage exceeds the OVP threshold, the device will shut down to protect the output.
  • Yes, the MAX17260SEWL+T is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and has been tested to ensure its reliability in harsh environments.

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MAX17260SEWL+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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