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MAX17303G+ - Analog Devices

Description: 1-Cell ModelGauge m5 EZ Fuel Gauge with Protector, Internal Self-Discharge Detection and SHA-256 Authentication

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MAX17303G+ - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - T1433+2C
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MAX17303G+ - Analog Devices  - 3D model - Small Outline No-lead - T1433+2C
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MAX17303G+ Details

  • Manufacturer Part Number:

    MAX17303G+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-LFCSP-3X3X0.75

  • Package Description:

    TDFN-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-06-20

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    Cascade Function:N;CTL:Y;Integrated MOSFET:N;PS:N

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY GAUGE

  • JESD-30 Code:

    S-PDSO-N14

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC14,.12,16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.05 mA

  • Supply Voltage-Max (Vsup):

    4.9 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.8V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX17303G+ Frequently Asked Questions (FAQs)

  • The MAX17303G+ requires careful layout and placement to ensure proper operation. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths.
  • The selection of input and output capacitors depends on the specific application requirements. In general, low-ESR capacitors with a high ripple current rating are recommended. The datasheet provides guidelines for capacitor selection, and additional information can be found in the application notes.
  • The MAX17303G+ is rated for operation from -40°C to +125°C. However, the device's performance and reliability may be affected at extreme temperatures. It is recommended to consult the datasheet and application notes for more information on temperature-related considerations.
  • The MAX17303G+ has a built-in OVP feature that can be enabled by connecting the OVP pin to a voltage source. The OVP threshold can be set by selecting the appropriate resistor values. The datasheet provides more information on implementing OVP with the MAX17303G+.
  • The recommended startup sequence for the MAX17303G+ is to first apply the input voltage, followed by the enable signal. This ensures that the device is properly biased and configured before the output voltage is enabled.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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