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MAX17330X22+T - Analog Devices

Description: AccuCharge + ModelGauge 1-Cell Charger, Fuel Gauge, and Protector

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MAX17330X22+T - Analog Devices PCB footprint - BGA - BGA - W151J2+1
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MAX17330X22+T - Analog Devices  - 3D model - BGA - W151J2+1
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MAX17330X22+T Details

  • Manufacturer Part Number:

    MAX17330X22+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    15-WLCSP-N/A

  • Package Description:

    WLP-15

  • Pin Count:

    15

  • Manufacturer Package Code:

    15-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2021-06-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    Cascade Function:N;CTL:Y;Integrated MOSFET:N;PS:N

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY GAUGE

  • JESD-30 Code:

    R-XBGA-B15

  • Length:

    2.448 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA15,3X5,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Current-Max (Isup):

    0.052 mA

  • Supply Voltage-Max (Vsup):

    4.9 V

  • Supply Voltage-Min (Vsup):

    2.16 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.908 mm

MAX17330X22+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX17330X22+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 10uF to 22uF, and the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value between 22uF to 47uF. The capacitor selection also depends on the specific application requirements, such as ripple current and voltage rating.
  • The MAX17330X22+T has an operating ambient temperature range of -40°C to +125°C, but the maximum junction temperature should not exceed 150°C. The device should be derated for temperatures above 85°C to ensure reliable operation.
  • The MAX17330X22+T has a built-in OVP feature that can be enabled by connecting the OVP pin to a voltage source. The OVP threshold can be set by selecting the appropriate resistor value between the OVP pin and the input voltage. The device will shut down if the input voltage exceeds the OVP threshold.
  • The recommended input voltage range for the MAX17330X22+T is 2.5V to 5.5V, but the device can operate with input voltages as low as 2.2V and as high as 6V. However, the output voltage regulation and efficiency may be affected at input voltages outside the recommended range.

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MAX17330X22+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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