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MAX17482GTL+ - Analog Devices

Description: Power Management Specialized - PMIC NDA IC

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PCB Footprints
MAX17482GTL+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T4055+2
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3D Models
MAX17482GTL+ - Analog Devices  - 3D model - Quad Flat No-Lead - T4055+2
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MAX17482GTL+ Details

  • Manufacturer Part Number:

    MAX17482GTL+

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFN-40

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-XQCC-N40

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.19SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    800 kHz

  • Technology:

    BICMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

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MAX17482GTL+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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