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MAX17525ATP+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX17525ATP+ - Power Limiter & Undervoltage Protection Device, 5.5 V to 60 V in, TQFN-20

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PCB Footprints
MAX17525ATP+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T2055+5C
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MAX17525ATP+ - Analog Devices  - 3D model - Quad Flat No-Lead - T2055+5C
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MAX17525ATP+ Details

  • Manufacturer Part Number:

    MAX17525ATP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-LFCSP-5X5X0.75

  • Package Description:

    TQFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-LFCSP-5X5X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2016-09-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    5

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    60 V

  • Supply Voltage-Min (Vsup):

    5.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX17525ATP+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX17525ATP+ involves keeping the input capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the input capacitors. Additionally, it is recommended to place the device near the power source and to use a low-ESR capacitor for the input bypass capacitor.
  • To optimize the performance of the MAX17525ATP+, it is recommended to carefully select the input and output capacitors, optimize the PCB layout, and adjust the compensation components according to the specific application requirements. Additionally, it is recommended to follow the guidelines provided in the datasheet and to consult with Analog Devices' application notes and technical support team if needed.
  • The MAX17525ATP+ has a maximum junction temperature of 150°C. To ensure reliable operation, it is recommended to keep the device temperature below 125°C. This can be achieved by providing adequate heat sinking, using a thermally conductive PCB material, and minimizing the power dissipation in the device.
  • To troubleshoot issues with the MAX17525ATP+, it is recommended to follow a systematic approach, starting with checking the power supply, input and output voltages, and the device's operating frequency. Additionally, it is recommended to consult the datasheet, application notes, and Analog Devices' technical support team for guidance on troubleshooting specific issues.
  • The MAX17525ATP+ is designed to meet the EMI and EMC requirements of most applications. However, it is recommended to follow good PCB design practices, such as using a solid ground plane, minimizing the length of the traces, and using shielding and filtering components as needed. Additionally, it is recommended to consult the datasheet and application notes for specific guidance on EMI and EMC considerations.

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MAX17525ATP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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