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MAX20089ATPB/VY+T - Analog Devices

Description: Current Switch Regulator High-Side 600mA 20-TQFN-EP (4x4)

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MAX20089ATPB/VY+T - Analog Devices - PCB symbol
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PCB Footprints
MAX20089ATPB/VY+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 20-TQFN-EP (4x4)
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MAX20089ATPB/VY+T - Analog Devices - 3D model - Quad Flat No-Lead - 20-TQFN-EP (4x4)
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MAX20089ATPB/VY+T Details

  • Manufacturer Part Number:

    MAX20089ATPB/VY+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-LFCSP_SS-4X4X0.75

  • Package Description:

    SWTQFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-LFCSP_SS-4X4X0.75

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-04-26

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    Adjustable Current Limit

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAX20089ATPB/VY+T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX20089ATPB/VY+T involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • The selection of input and output capacitors for the MAX20089ATPB/VY+T depends on the specific application requirements. In general, X5R or X7R ceramic capacitors with a voltage rating of 10V or higher are recommended for the input and output capacitors. The capacitance value should be chosen based on the desired ripple voltage and the output current requirements.
  • The maximum ambient temperature range for the MAX20089ATPB/VY+T is -40°C to +125°C. However, the device's performance and reliability may be affected at temperatures above 85°C, and it's recommended to derate the output current and voltage accordingly.
  • Proper thermal management of the MAX20089ATPB/VY+T involves ensuring good airflow around the device, using a heat sink if necessary, and keeping the device away from heat sources. The device's thermal pad should be soldered to a solid copper plane on the PCB to ensure good heat dissipation.
  • The recommended input voltage range for the MAX20089ATPB/VY+T is 4.5V to 5.5V. Operating the device outside of this range may affect its performance and reliability.

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MAX20089ATPB/VY+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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