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MAX2021ETX+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX2021ETX+ - RF MOD/DEMOD, 650MHZ-1.2GHZ, TQFN-36

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PCB Footprints
MAX2021ETX+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T3666+2
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MAX2021ETX+ - Analog Devices  - 3D model - Quad Flat No-Lead - T3666+2
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MAX2021ETX+ Details

  • Manufacturer Part Number:

    MAX2021ETX+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    36-LFCSP-6X6X0.75

  • Package Description:

    6 X 6 MM, ROHS COMPLIANT, TQFN-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    36-LFCSP-6X6X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2006-04-05

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • JESD-30 Code:

    S-XQCC-N36

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC36,.25SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.315 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

MAX2021ETX+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX2021ETX+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout diagram that can be used as a reference.
  • To ensure the MAX2021ETX+ is properly biased, make sure to connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. Also, ensure that the bypass capacitors (C1 and C2) are properly connected between VCC and GND, and that the capacitors are of high quality and have low ESR.
  • The MAX2021ETX+ can support data rates up to 100 Mbps, making it suitable for high-speed applications such as USB, Ethernet, and other high-speed interfaces.
  • The MAX2021ETX+ has built-in ESD protection, but additional protection measures can be taken to ensure the device is protected from electrostatic discharge. This includes using ESD-protected handling and storage procedures, and adding external ESD protection devices such as TVS diodes or ESD arrays.
  • The MAX2021ETX+ has an operating temperature range of -40°C to +85°C, making it suitable for use in a wide range of applications, from industrial to consumer electronics.

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MAX2021ETX+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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