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MAX20303BEWN+T - Analog Devices

Description: PMIC with Ultra Low IQ Voltage Regulators, Battery Charger and Fuel Gaugefor Small Lithium Ion Systems

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MAX20303BEWN+T - Analog Devices - PCB symbol
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MAX20303BEWN+T - Analog Devices PCB footprint - BGA - BGA - MAX20303BEWN+z
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MAX20303BEWN+T - Analog Devices - 3D model - BGA - MAX20303BEWN+z
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MAX20303BEWN+T Details

  • Manufacturer Part Number:

    MAX20303BEWN+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    56-WLCSP-N/A

  • Pin Count:

    56

  • Manufacturer Package Code:

    56-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-11-03

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    R-XBGA-B56

  • Length:

    4.178 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA56,7X8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Nom (Vsup):

    3.7 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    2.45

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.678 mm

MAX20303BEWN+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX20303BEWN+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power-up and initialization, make sure to follow the power-up sequence specified in the datasheet. Apply the power supply to the device in the correct order (VCC, then VIN), and ensure that the input voltage is within the recommended range. Also, make sure to add a 10nF capacitor between the EN pin and GND to filter out noise and ensure proper enable functionality.
  • The maximum current that the MAX20303BEWN+T can deliver depends on the input voltage, output voltage, and ambient temperature. The output current capability can be calculated using the equations provided in the datasheet. Typically, the device can deliver up to 3A of output current. However, it's essential to consider the thermal limitations and ensure that the device is properly heatsinked to prevent overheating.
  • To troubleshoot issues with the MAX20303BEWN+T, start by checking the input voltage, output voltage, and current. Verify that the input voltage is within the recommended range and that the output voltage is within the specified tolerance. Check for any signs of overheating, such as excessive temperature rise or thermal shutdown. Use an oscilloscope to check for any noise or oscillations on the output. Also, review the PCB layout and ensure that it follows the recommended guidelines.
  • The MAX20303BEWN+T is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal limitations and ensure that the device is properly heatsinked to prevent overheating. Additionally, the output current capability may be reduced at high temperatures, and the device may enter thermal shutdown to prevent damage.

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MAX20303BEWN+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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