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MAX20343EEWE+T - Analog Devices

Description: Ultra-Low Quiescent Current, Low Noise 3.5W Buck-Boost Regulator

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MAX20343EEWE+T - Analog Devices - PCB symbol
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PCB Footprints
MAX20343EEWE+T - Analog Devices PCB footprint - BGA - BGA - W161C2+1
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3D Models
MAX20343EEWE+T - Analog Devices - 3D model - BGA - W161C2+1
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MAX20343EEWE+T Details

  • Manufacturer Part Number:

    MAX20343EEWE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-WLCSP-N/A

  • Package Description:

    WLP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-10-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.9 V

  • Input Voltage-Nom:

    3.7 V

  • JESD-30 Code:

    R-PBGA-B16

  • Length:

    2.008 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    2.5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.768 mm

MAX20343EEWE+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX20343EEWE+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power-up and initialization of the MAX20343EEWE+T, follow these steps: 1) Apply power to the device in the correct sequence (VCC, then VIN), 2) Ensure the input voltage (VIN) is within the recommended range, 3) Add a 10nF to 100nF decoupling capacitor between VCC and GND, and 4) Initialize the device according to the recommended startup sequence outlined in the datasheet.
  • The MAX20343EEWE+T has a maximum junction temperature (TJ) of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines provided in the datasheet. Additionally, keep the device's power dissipation (PD) below the recommended maximum value, and avoid operating the device in high-temperature environments.
  • To troubleshoot issues with the MAX20343EEWE+T, follow these steps: 1) Verify the input voltage and current, 2) Check the device's power-up sequence, 3) Ensure the output voltage is within the recommended range, 4) Verify the device's configuration and settings, 5) Use an oscilloscope to monitor the output voltage and current, and 6) Consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, the MAX20343EEWE+T is a high-frequency device and requires proper EMI/EMC design considerations. Ensure the device is placed in a shielded area, use a common-mode choke or ferrite bead to filter the input voltage, and follow the EMI/EMC guidelines provided in the datasheet and application notes. Additionally, use a layout that minimizes radiated emissions and ensures good signal integrity.

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MAX20343EEWE+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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