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MAX211EEAI+ - Analog Devices

Description: ● Saves Board Space • Integrated High ±15kV HBM ESD Protection • Integrated Charge Pump Circuitry - Eliminates the Need for a Bipolar ±12V Supply - Enables Single Supply Operation From +5V Supply • Integrated 0.1μF Capacitors (MAX203E, MAX205E) • 24 pin SSOP Package Saves up to 40% Versus SO Package ● Saves Power for Reduced Power Requirements • 1μA Shutdown Mode • 15μA Shutdown Mode for MAX213E

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PCB Footprints
MAX211EEAI+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 28 SSOP
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3D Models
MAX211EEAI+ - Analog Devices  - 3D model - Small Outline Packages - 28 SSOP
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MAX211EEAI+ Details

  • Manufacturer Part Number:

    MAX211EEAI+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    28-SSOP-5.3_MM

  • Package Description:

    5.30 MM, MO-150, SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    28-SSOP-5.3_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1995-09-27

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    TRISTATABLE RECEIVERS; EXTERNAL CHARGE PUMP

  • Differential Output:

    NO

  • Driver Number of Bits:

    4

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-E; TIA-232-E; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0016 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    10000 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    1.99 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.29 mm

MAX211EEAI+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX211EEAI+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces to reduce noise and interference. A 4-layer PCB with a dedicated analog ground layer is recommended.
  • To ensure the MAX211EEAI+ operates within its specified temperature range, provide adequate heat sinking, avoid overheating, and ensure good airflow around the device. The device's thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • The recommended power-up sequence for the MAX211EEAI+ is to power up the analog supply (VCC) before the digital supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, which helps to prevent latch-up and ensures proper device operation.
  • To handle ESD protection for the MAX211EEAI+, use ESD protection devices such as TVS diodes or ESD protection arrays on the input lines. Additionally, follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.
  • The recommended input signal conditioning for the MAX211EEAI+ involves using a low-pass filter or a band-pass filter to remove noise and interference from the input signal. Additionally, use a voltage divider or an attenuator to ensure the input signal is within the specified range of the device.

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MAX211EEAI+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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