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MAX22166CAEE+T - Analog Devices

Description: Reinforced, Fast, Low-Power, Six-Channel Digital Isolators

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MAX22166CAEE+T - Analog Devices - PCB symbol
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PCB Footprints
MAX22166CAEE+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - E16MS+2
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MAX22166CAEE+T - Analog Devices - 3D model - Small Outline Packages - E16MS+2
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MAX22166CAEE+T Details

  • Manufacturer Part Number:

    MAX22166CAEE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2021-12-22

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.89 mm

MAX22166CAEE+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX22166CAEE+T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the isolation barrier. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable operation of the MAX22166CAEE+T in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range of -40°C to +125°C.
  • The MAX22166CAEE+T has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. The device can withstand ESD events up to ±2kV human body model (HBM) and ±200V machine model (MM).
  • Yes, the MAX22166CAEE+T is designed to meet the requirements of safety-critical applications, such as industrial control systems, medical devices, and automotive systems. It's essential to follow the safety guidelines and recommendations provided in the datasheet and to consult with Analog Devices Inc. for specific safety certifications and compliance.
  • To troubleshoot common issues with the MAX22166CAEE+T, start by verifying the power supply voltage, checking the input and output connections, and ensuring that the device is properly configured. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet and application notes for troubleshooting guidelines.

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MAX22166CAEE+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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