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MAX22345SAAP+ - Analog Devices

Description: Digital Isolators Four Channel, Low Power, High Speed, Dig

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MAX22345SAAP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - A20+1
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MAX22345SAAP+ - Analog Devices  - 3D model - Small Outline Packages - A20+1
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MAX22345SAAP+ Details

  • Manufacturer Part Number:

    MAX22345SAAP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-SSOP-5.30_MM

  • Package Description:

    SSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-SSOP-5.30_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-12-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    7.1 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

MAX22345SAAP+ Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the MAX22345SAAP+. Ensure a solid ground plane, keep the analog and digital sections separate, and use a 4-layer board with a dedicated power plane. Also, place the device close to the power source and use short, direct traces for power and ground connections.
  • To configure the MAX22345SAAP+, start by reading the datasheet and understanding the device's pinout and functionality. Then, use the MAX22345 evaluation kit or a similar development board to test and validate your design. You can also use Analog Devices' simulation tools, such as LTspice, to model and simulate your circuit.
  • The MAX22345SAAP+ has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Also, keep the device away from other heat sources on the board, and use thermal vias to connect the device to a solid ground plane.
  • To troubleshoot issues with the MAX22345SAAP+, start by checking the power supply and ensuring it's stable and within the recommended range. Verify that the input and output capacitors are properly sized and placed. Use an oscilloscope to monitor the output voltage and current, and check for any signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The MAX22345SAAP+ is a commercial-grade device, but it can be used in high-reliability applications with proper design and testing. For high-temperature applications, consider using the industrial-grade version, MAX22345SAIP+, which is rated for operation up to 125°C. Always consult the datasheet and application notes for specific guidance on using the device in your application.

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MAX22345SAAP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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