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MAX253CPA+ - Analog Devices

Description: MAX253CPA+, General Purpose Driver, 8-Pin, PDIP N

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MAX253CPA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX253CPA+ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8 DIP
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3D Models
MAX253CPA+ - Analog Devices - 3D model - Dual-In-Line Packages - 8 DIP
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MAX253CPA+ Details

  • Manufacturer Part Number:

    MAX253CPA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-PDIP-300_MIL

  • Package Description:

    ROHS COMPLIANT, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-PDIP-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1994-01-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.375 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.62 mm

MAX253CPA+ Frequently Asked Questions (FAQs)

  • The MAX253CPA+ requires careful layout and placement to ensure proper operation. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the input and output traces short and away from noise sources, and using a solid ground plane to reduce noise and EMI.
  • The MAX253CPA+ has a maximum junction temperature of 150°C. To ensure reliable operation, it is recommended to provide adequate heat sinking and thermal management, such as using a heat sink or thermal pad, and keeping the device away from high-temperature sources.
  • The recommended power-up sequence for the MAX253CPA+ is to apply the power supply voltage (VCC) before applying the input signal. This ensures that the internal biasing and reference circuits are properly established before the input signal is applied.
  • Common issues with the MAX253CPA+ include oscillation, noise, and incorrect output voltage. To troubleshoot these issues, check the layout and placement, ensure proper power-up sequencing, and verify that the input signal is within the recommended range. Also, check for any signs of overheating or damage to the device.
  • The MAX253CPA+ is a high-reliability device, but it is still important to follow proper design and testing procedures to ensure that it meets the requirements of the application. This includes performing thorough testing and validation, using redundant or fail-safe designs, and following industry standards and regulations.

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MAX253CPA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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