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MAX253ESA+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX253ESA+T - Transformer Driver, 2.5 V to 6 V in, NSOIC-8

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MAX253ESA+T - Analog Devices - PCB symbol
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PCB Footprints
MAX253ESA+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 21-0041
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3D Models
MAX253ESA+T - Analog Devices - 3D model - Small Outline Packages - 21-0041
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MAX253ESA+T Details

  • Manufacturer Part Number:

    MAX253ESA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    0.150 INCH, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1994-01-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX253ESA+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX253ESA+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The MAX253ESA+T requires a single 5V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the power supply has stabilized, and to ensure that the power supply is within the recommended operating range.
  • A 0.1uF ceramic capacitor is recommended for bypassing the power supply pins (VCC and GND) of the MAX253ESA+T. The capacitor should be placed as close as possible to the device, with the shortest possible leads.
  • The MAX253ESA+T has a maximum junction temperature of 150°C. To handle thermal considerations, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. In high-temperature environments, consider using a thermal interface material (TIM) to improve heat transfer.
  • The MAX253ESA+T has built-in ESD protection, but it's still recommended to take precautions to prevent ESD damage. Use an ESD wrist strap or mat when handling the device, and ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes and resistors.

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MAX253ESA+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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