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MAX2658EWT+T - Analog Devices

Description: GPS/GNSS Low-Noise Amplifiers

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MAX2658EWT+T - Analog Devices PCB footprint - Other - Other - BGA6C40P2X3_127X86X69
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MAX2658EWT+T Details

  • Manufacturer Part Number:

    MAX2658EWT+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    6-WLCSP-N/A

  • Package Description:

    1.26 X 0.86 MM, 0.65 MM HEIGHT, ROHS COMPLIANT, WLP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    6-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • Date Of Intro:

    2009-10-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    CMOS COMPATIBLE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    17.7 dB

  • Input Power-Max (CW):

    5 dBm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Frequency-Max:

    2500 MHz

  • Operating Frequency-Min:

    500 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    BGA6,2X3,16

  • Power Supplies:

    1.8/3 V

  • RF/Microwave Device Type:

    LOW NOISE AMPLIFIER

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • VSWR-Max:

    1.92

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MAX2658EWT+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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