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MAX30112EWG+T - Analog Devices

Description: Biometric Sensors Integrated Biosensor for Mobile Applications

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PCB Footprints
MAX30112EWG+T - Analog Devices PCB footprint - BGA - BGA - PACKAGE OUTLINE 24 BUMPS WLP PKG. 0.4 mm PITCH, W241F2+1
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3D Models
MAX30112EWG+T - Analog Devices  - 3D model - BGA - PACKAGE OUTLINE 24 BUMPS WLP PKG. 0.4 mm PITCH, W241F2+1
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MAX30112EWG+T Details

  • Manufacturer Part Number:

    MAX30112EWG+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-WLCSP-N/A

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-08-30

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Time@Peak Reflow Temperature-Max (s):

    30

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MAX30112EWG+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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