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MAX3097ECSE+ - Analog Devices

Description: MAX3097ECSE+, Triple Line Receiver, RS-485, RS-422, 3 (RS422), 3 (RS485)-RX 32Mbit/s Differential 3 → 5.5 V

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MAX3097ECSE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S16+5
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MAX3097ECSE+ - Analog Devices  - 3D model - Small Outline Packages - S16+5
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MAX3097ECSE+ Details

  • Manufacturer Part Number:

    MAX3097ECSE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-SOIC_N-150_MIL

  • Package Description:

    0.150 INCH, SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2000-08-10

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    85 ns

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX3097ECSE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3097ECSE+ involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing the device close to the signal source. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the device's exposed pad should be connected to a solid ground plane to improve thermal performance.
  • To ensure reliable operation of the MAX3097ECSE+ in high-temperature environments, it is essential to provide adequate heat sinking, such as a thermal pad or a heat sink attached to the device's exposed pad. Additionally, the device should be operated within its recommended operating temperature range, and the power supply should be designed to minimize thermal gradients.
  • The MAX3097ECSE+ has built-in ESD protection, but it is still important to follow proper ESD handling procedures during assembly and testing. The device should be handled in an ESD-controlled environment, and ESD-sensitive devices should be protected with ESD shielding or protective packaging.
  • To troubleshoot issues with the MAX3097ECSE+, start by verifying the power supply and signal connections. Check for proper termination, signal integrity, and power supply noise. Use an oscilloscope to monitor the device's output and input signals. If the issue persists, consult the datasheet and application notes for guidance, or contact Analog Devices' technical support.
  • When using the MAX3097ECSE+ in a redundant or fault-tolerant system, it is essential to ensure that the device is properly isolated from other components and that the system is designed to detect and respond to faults. This may involve using redundant power supplies, signal duplication, and fault detection circuitry.

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MAX3097ECSE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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