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MAX3120CSA+ - Analog Devices

Description: IrDA 1.2 Compatible: 2.4kbps to 115.2kbps ♦ +3V to +5.5V Single-Supply Operation ♦ Flexible Optics Selection and Layout ♦ 120µA Supply Current ♦ 10nA Shutdown Supply Current ♦ 200mA, High-Current Infrared LED Drive

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MAX3120CSA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8 SO*
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MAX3120CSA+ - Analog Devices  - 3D model - Small Outline Packages - 8 SO*
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MAX3120CSA+ Details

  • Manufacturer Part Number:

    MAX3120CSA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    0.150 INCH, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1998-10-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX3120CSA+ Frequently Asked Questions (FAQs)

  • A good layout and routing practice for the MAX3120CSA+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, use short traces and avoid crossing digital and analog signals. Refer to the application note AN-1149 for more detailed guidelines.
  • To ensure the MAX3120CSA+ operates within the specified temperature range, make sure to provide adequate heat sinking, avoid overheating, and keep the device away from high-temperature sources. The device is rated for operation from -40°C to +85°C. Refer to the thermal management section in the datasheet for more information.
  • The recommended power-up sequence for the MAX3120CSA+ is to apply VCC first, followed by VDD. This ensures that the internal voltage regulators are powered up correctly and prevents any potential latch-up conditions.
  • To troubleshoot issues with the MAX3120CSA+, start by checking the power supply voltages, clock signals, and data transmission lines. Verify that the device is properly configured and that the transmit and receive pins are correctly connected. Use a logic analyzer or oscilloscope to debug the signal waveforms and identify any issues.
  • While the MAX3120CSA+ is primarily designed for PCIe applications, it can be used in other high-speed serial applications with some modifications. However, this may require additional circuitry and design changes to accommodate the specific application requirements. Consult with Analog Devices' technical support for guidance on using the MAX3120CSA+ in non-PCIe applications.

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MAX3120CSA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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