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MAX31725MTA+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX31725MTA+ - TEMPERATURE SENSOR, 0.7DEG C, TDFN-8

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MAX31725MTA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX31725MTA+ - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - T833+2 (8 TDFN)
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MAX31725MTA+ - Analog Devices - 3D model - Small Outline No-lead - T833+2 (8 TDFN)
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MAX31725MTA+ Details

  • Manufacturer Part Number:

    MAX31725MTA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-LFCSP-3X3X0.75

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • Date Of Intro:

    2012-10-05

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Accuracy-Max (Cel):

    0.7 Cel

  • Additional Feature:

    IT ALSO HAS ACCURACY 0.5 DEGREE CELCIUS

  • Body Breadth:

    3 mm

  • Body Height:

    0.75 mm

  • Body Length or Diameter:

    3 mm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    8

  • Operating Current-Max:

    0.925 mA

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT

  • Supply Voltage-Max:

    3.7 V

  • Supply Voltage-Min:

    2.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Termination Type:

    SOLDER

MAX31725MTA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31725MTA+ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value of at least 10uF, while the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value of at least 22uF. The capacitor values and types should be chosen based on the specific application requirements and the device's operating frequency.
  • The MAX31725MTA+ has an operating ambient temperature range of -40°C to +125°C, but the device's performance and reliability may be affected at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance.
  • Yes, the MAX31725MTA+ is designed to operate in high-vibration environments, but it's recommended to follow proper PCB mounting and assembly techniques to ensure the device's reliability and performance. Additionally, the device's operating frequency and output voltage should be chosen to minimize the effects of vibration on the device's performance.
  • Common issues with the MAX31725MTA+ can be troubleshooted by checking the input voltage, output load, and PCB layout. Ensure that the input voltage is within the recommended range, the output load is within the device's current rating, and the PCB layout is optimized for the device's operation. Additionally, check for any signs of overheating, such as excessive temperature rise or thermal shutdown.

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MAX31725MTA+ Overview

Use the download button to access the MAX31725MTA+ schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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