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MAX3245EEUI+ - Analog Devices

Description: MAX3245EEUI+, Line Transceiver, EIA/TIA-232, RS-232, V.24, V.28 3 5 3 1000kbit/s, 3 → 5.5 V, 28-Pin TSSOP

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MAX3245EEUI+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - Max 21-0066_F (28 SSOP)
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MAX3245EEUI+ - Analog Devices  - 3D model - Small Outline Packages - Max 21-0066_F (28 SSOP)
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MAX3245EEUI+ Details

  • Manufacturer Part Number:

    MAX3245EEUI+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    28-TSSOP_4.4-4.4_MM

  • Package Description:

    TSSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    28-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1998-01-03

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Differential Output:

    NO

  • Driver Number of Bits:

    3

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232; V.24; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.0016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX3245EEUI+ Frequently Asked Questions (FAQs)

  • The MAX3245EEUI+ is a high-speed device, and proper layout and placement are crucial for optimal performance. It is recommended to follow the guidelines in the datasheet, such as keeping the device close to the signal sources, using short traces, and avoiding vias and corners. Additionally, it is recommended to use a solid ground plane and to decouple the power supply pins with capacitors.
  • The MAX3245EEUI+ has a maximum junction temperature of 150°C. To ensure reliable operation, it is recommended to keep the device temperature below 125°C. This can be achieved by using a heat sink, improving air flow, and reducing power consumption. The thermal resistance of the package is also important, and it is recommended to use a thermal pad or thermal interface material to improve heat transfer.
  • The recommended power-up sequence for the MAX3245EEUI+ is to apply the power supply voltage (VCC) before the input signals. This ensures that the device is properly biased and configured before the input signals are applied. It is also recommended to use a slow power-up ramp to prevent voltage overshoots and to reduce electromagnetic interference (EMI).
  • Common issues with the MAX3245EEUI+ include signal integrity problems, power supply noise, and incorrect configuration. To troubleshoot these issues, it is recommended to use oscilloscopes and logic analyzers to monitor the signals, and to check the power supply voltage and noise levels. It is also recommended to review the device configuration and to consult the datasheet and application notes for guidance.
  • The MAX3245EEUI+ has built-in electrostatic discharge (ESD) protection and latch-up prevention measures. However, it is still recommended to follow proper ESD handling procedures when handling the device, such as using an ESD wrist strap or mat, and to use ESD protection devices such as TVS diodes or ESD arrays. Additionally, it is recommended to use a latch-up prevention circuit, such as a resistor and capacitor in series, to prevent latch-up conditions.

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MAX3245EEUI+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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