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MAX3362AKA+T - Analog Devices

Description: RS-422/RS-485 Interface IC 3.3V, High-Speed, RS-485/RS-422 Transceiver in SOT Package

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PCB Footprints
MAX3362AKA+T - Analog Devices PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - 8 SOT23
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3D Models
MAX3362AKA+T - Analog Devices  - 3D model - SOT23 (8-Pin) - 8 SOT23
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MAX3362AKA+T Details

  • Manufacturer Part Number:

    MAX3362AKA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOT_23-N/A

  • Package Description:

    SOT-23, 8 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOT_23-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-10-23

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.001 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Receive Delay-Max:

    50 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    50 ns

  • Width:

    1.625 mm

MAX3362AKA+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3362AKA+T involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down, the MAX3362AKA+T requires a monotonic power supply ramp-up and ramp-down. A soft-start circuit can be used to limit the inrush current during power-up. Additionally, the device should be powered down by reducing the supply voltage to 0V before removing the input signal.
  • The MAX3362AKA+T has an operating temperature range of -40°C to +85°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • To troubleshoot issues with the MAX3362AKA+T, start by checking the input and output voltage levels, as well as the device's power supply and ground connections. Use an oscilloscope to check for oscillations or noise on the output. Also, verify that the device is properly configured and that the input signal is within the specified range.
  • The MAX3362AKA+T is a commercial-grade device and may not be suitable for high-reliability or safety-critical applications. For such applications, consider using a device with a higher reliability rating, such as a device with a MIL-PRF-38535 or AEC-Q100 qualification.

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MAX3362AKA+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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