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MAX3381EEUP+T - Analog Devices

Description: RS-232 Interface IC +2.35V to +5.5V, 1 uA, 2Tx/2Rx RS-232 Transceivers with +/-15kV ESD-Protected I/O and Logic Pins

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MAX3381EEUP+T - Analog Devices - PCB symbol
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MAX3381EEUP+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U20+2
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MAX3381EEUP+T - Analog Devices - 3D model - Small Outline Packages - U20+2
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MAX3381EEUP+T Details

  • Manufacturer Part Number:

    MAX3381EEUP+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-TSSOP_4.4-4.4_MM

  • Package Description:

    TSSOP, TSSOP20,.25

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-TSSOP_4.4-4.4_MM

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-08-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232; V.24; V.28

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    7.4 V

  • Output Low Current-Max:

    0.0005 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.35 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX3381EEUP+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3381EEUP+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the battery. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • The choice of external components for the MAX3381EEUP+T depends on the specific application requirements, such as the input voltage, output voltage, and output current. A good starting point is to use the component values recommended in the datasheet, and then adjust them based on the specific requirements of the application. It's also recommended to use components with low ESR and high Q to minimize losses and ensure stability.
  • The MAX3381EEUP+T can operate in ambient temperatures up to 85°C, but the device's performance and reliability may be affected at higher temperatures. It's recommended to use thermal management techniques, such as heat sinks or thermal pads, to keep the device temperature below 85°C.
  • To ensure proper power-up and power-down of the MAX3381EEUP+T, it's recommended to use a soft-start circuit to limit the inrush current during power-up, and to use a power-down sequence that ensures the device is fully discharged before power is removed. Additionally, it's recommended to use a voltage supervisor or reset circuit to ensure that the device is properly reset during power-up.
  • Common failure modes of the MAX3381EEUP+T include overvoltage, undervoltage, and overheating. To mitigate these failure modes, it's recommended to use overvoltage protection circuits, undervoltage lockout circuits, and thermal management techniques, such as heat sinks or thermal pads. Additionally, it's recommended to use a fuse or current limiter to prevent overcurrent conditions.

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MAX3381EEUP+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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