Part Image

MAX3646ETG+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX3646ETG+ - Laser Diode Driver, SFP/SFF Optical Modules, 2.97V to 3.63V, TQFN-24

Download MAX3646ETG+ Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MAX3646ETG+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T2444+4
click to zoom
3D Models
MAX3646ETG+ - Analog Devices  - 3D model - Quad Flat No-Lead - T2444+4
click to zoom

MAX3646ETG+ Details

  • Manufacturer Part Number:

    MAX3646ETG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    24-LFCSP-4X4X0.75

  • Package Description:

    4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, TQFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-LFCSP-4X4X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-02-11

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAX3646ETG+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3646ETG+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power supply. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure the MAX3646ETG+ operates within the specified temperature range, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink with a thermal resistance of less than 10°C/W, and ensuring good airflow around the device. Additionally, the device should be operated within the specified power dissipation limits, and the junction temperature should be monitored to prevent overheating.
  • The recommended input capacitance for the MAX3646ETG+ is 10nF to 100nF. This capacitance helps to filter out high-frequency noise and ensures stable operation. However, the optimal input capacitance value may vary depending on the specific application and input signal characteristics.
  • To troubleshoot issues with the MAX3646ETG+, start by verifying the power supply voltage and ensuring it's within the specified range. Check the input and output signals using an oscilloscope to identify any anomalies. Also, verify the PCB layout and ensure it meets the recommended guidelines. If the issue persists, consult the datasheet and application notes, and consider contacting Analog Devices' technical support for further assistance.
  • The MAX3646ETG+ is a high-reliability device, but it's essential to follow the recommended design and layout guidelines to ensure reliable operation. Additionally, the device should be operated within the specified temperature range, and the power supply voltage should be regulated to prevent overvoltage conditions. It's also recommended to implement redundant or fail-safe mechanisms in safety-critical applications to ensure continued safe operation in the event of a device failure.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MAX3646ETG+ Overview

Use the download button to access the MAX3646ETG+ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX36, or try a keyword search, such as Other Interface ICs

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

Parts related to MAX3646ETG+

Showing 0 results