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MAX3795ETG+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX3795ETG+ - Laser Diode Driver, SFP VCSEL, 4.25Gbps, 2.97V to 3.63V, TQFN-24

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MAX3795ETG+ - Analog Devices - PCB symbol
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PCB Footprints
MAX3795ETG+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T2444+3
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3D Models
MAX3795ETG+ - Analog Devices - 3D model - Quad Flat No-Lead - T2444+3
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MAX3795ETG+ Details

  • Manufacturer Part Number:

    MAX3795ETG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    24-LFCSP-4X4X0.75

  • Package Description:

    4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, TQFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-LFCSP-4X4X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-08-11

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAX3795ETG+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3795ETG+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power supply. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure the MAX3795ETG+ operates within its specified temperature range, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the device. Additionally, the device should be operated within its specified power dissipation limits, and the ambient temperature should be kept within the recommended range.
  • The MAX3795ETG+ has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding oneself before handling the device, and using ESD protection devices such as wrist straps and mats. Additionally, the device should be stored in its original packaging or an ESD-safe container when not in use.
  • To troubleshoot issues with the MAX3795ETG+, start by reviewing the datasheet and application notes to ensure the device is being used within its specified operating conditions. Check the power supply voltage, input and output signals, and ensure the device is properly configured. Use oscilloscopes and other diagnostic tools to identify the source of the issue. If the problem persists, contact Analog Devices Inc. support or a qualified engineer for further assistance.
  • When using the MAX3795ETG+ in a high-reliability application, it's essential to follow proper design and manufacturing practices. This includes using a robust PCB design, selecting high-reliability components, and ensuring the device is operated within its specified temperature and power dissipation limits. Additionally, consider using redundant or fault-tolerant designs, and implementing error detection and correction mechanisms to ensure the system remains operational in the event of a failure.

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MAX3795ETG+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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