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MAX3799ETJ+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX3799ETJ+T - Limiting Amplifier, 2.85 V, 3.63 V, TQFN, 32 Pins, -40 ?C

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MAX3799ETJ+T - Analog Devices - PCB symbol
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PCB Footprints
MAX3799ETJ+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T3255+5
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3D Models
MAX3799ETJ+T - Analog Devices - 3D model - Quad Flat No-Lead - T3255+5
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MAX3799ETJ+T Details

  • Manufacturer Part Number:

    MAX3799ETJ+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    32-LFCSP-5X5X0.75

  • Package Description:

    ROHS COMPLIANT, TQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    32-LFCSP-5X5X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2009-08-12

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX3799ETJ+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3799ETJ+T involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down of the MAX3799ETJ+T, make sure to follow the recommended power-up sequence, which is to apply VCC first, followed by VEE. During power-down, remove VEE first, followed by VCC. Also, ensure that the input voltage ramps up and down slowly to prevent damage to the device.
  • The MAX3799ETJ+T has an operating temperature range of -40°C to +125°C. However, it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance and reliability.
  • To troubleshoot issues with the MAX3799ETJ+T, start by checking the power supply voltages and ensuring that they are within the recommended range. Next, verify that the input and output signals are within the specified voltage ranges. Use an oscilloscope to check for any signal distortion or noise. If the issue persists, consult the datasheet and application notes for further guidance.
  • Yes, the MAX3799ETJ+T is suitable for high-reliability and high-availability applications. It has a high MTBF (mean time between failures) rating and is designed to meet the requirements of demanding applications such as aerospace, defense, and industrial control systems.

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MAX3799ETJ+T Overview

Use the download button to access the MAX3799ETJ+T schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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