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MAX3872ETJ+ - Analog Devices

Description: MAX3872ETJ+, Clock Conditioner CML Differential, Single Ended 32-Pin TQFN

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Symbol
MAX3872ETJ+ - Analog Devices - PCB symbol
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PCB Footprints
MAX3872ETJ+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T3255-3
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3D Models
MAX3872ETJ+ - Analog Devices - 3D model - Quad Flat No-Lead - T3255-3
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MAX3872ETJ+ Details

  • Manufacturer Part Number:

    MAX3872ETJ+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    32-LFCSP-5X5X0.75

  • Package Description:

    5 X 5 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220-WHHD-2, TQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    32-LFCSP-5X5X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2003-02-25

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Applications:

    SDH; SONET

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.215 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX3872ETJ+ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise coupling. Use a common-mode choke or a ferrite bead to filter the input power lines.
  • Ensure the input voltage is within the recommended range (4.5V to 5.5V). Use a 0.1uF decoupling capacitor between VCC and GND, and a 10uF capacitor between VIN and GND. Configure the EN pin to enable the device, and the MODE pin to select the desired operating mode.
  • The maximum output current is 2A. Ensure the device is mounted on a PCB with a thermal pad connected to a solid ground plane. Use a heat sink or a thermal interface material to improve heat dissipation. Monitor the device temperature and reduce the output current if it exceeds 125°C.
  • Use an oscilloscope to monitor the input and output voltages, and check for noise or oscillations. Verify the input voltage and current, and ensure the device is properly configured. Check for thermal issues by monitoring the device temperature. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, the MAX3872ETJ+ is suitable for high-reliability and safety-critical applications. It is certified to AEC-Q100 Grade 1, and meets the requirements of IEC 60601-1 for medical devices. Consult the datasheet and relevant standards for specific certification details.

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MAX3872ETJ+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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