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MAX40025AAWT+T - Analog Devices

Description: Analog Comparators High Speed 1ns Comparator (3mV Hysteresis)

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MAX40025AAWT+T - Analog Devices - PCB symbol
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PCB Footprints
MAX40025AAWT+T - Analog Devices PCB footprint - BGA - BGA - W60D1+1
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3D Models
MAX40025AAWT+T - Analog Devices - 3D model - BGA - W60D1+1
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MAX40025AAWT+T Details

  • Manufacturer Part Number:

    MAX40025AAWT+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    6-WLCSP-N/A

  • Package Description:

    WLP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    6-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-04-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    10 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-XBGA-B6

  • Length:

    1.218 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    0.27 ns

  • Seated Height-Max:

    0.69 mm

  • Supply Current-Max:

    23 mA

  • Supply Voltage Limit-Max:

    3.6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.818 mm

MAX40025AAWT+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX40025AAWT+T involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure accuracy, use a high-precision shunt resistor, keep the shunt resistor close to the device, and use a Kelvin connection to the shunt resistor. Also, ensure that the device is operated within its specified temperature range and that the input voltage is within the recommended range.
  • The MAX40025AAWT+T can measure currents up to 50A, but the maximum current is limited by the shunt resistor and the PCB layout. A higher current measurement requires a lower shunt resistor value, but this also increases the power dissipation and reduces the accuracy.
  • Calibration involves adjusting the gain and offset of the device to match the shunt resistor value and the system requirements. This can be done using an external calibration circuit or by using the device's built-in calibration feature. Refer to the datasheet and application notes for more information.
  • Temperature affects the accuracy of the MAX40025AAWT+T by changing the gain and offset of the device. The device has a specified temperature range of -40°C to +125°C, and the accuracy is guaranteed within this range. However, the device can be calibrated to compensate for temperature effects.

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MAX40025AAWT+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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