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MAX44211ETP+T - Analog Devices

Description: Differential Amplifiers High Current Line Driver for Powerline Communications

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PCB Footprints
MAX44211ETP+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T2044+4C
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3D Models
MAX44211ETP+T - Analog Devices  - 3D model - Quad Flat No-Lead - T2044+4C
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MAX44211ETP+T Details

  • Manufacturer Part Number:

    MAX44211ETP+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-LFCSP-4X4X0.75

  • Package Description:

    TQFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-LFCSP-4X4X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2015-07-14

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    55 mA

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAX44211ETP+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX44211ETP+T involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to reduce noise and electromagnetic interference (EMI).
  • To ensure the MAX44211ETP+T is properly biased, make sure to connect the VCC pin to a stable voltage source between 2.7V and 5.5V, and the GND pin to a solid ground plane. Also, ensure that the input voltage (VIN) is within the recommended range of 2.7V to 5.5V, and that the output voltage (VOUT) is within the recommended range of 1.8V to 5.5V.
  • The MAX44211ETP+T can handle a maximum output current of 100mA. However, it's recommended to keep the output current below 50mA to ensure optimal performance and to prevent overheating.
  • To protect the MAX44211ETP+T from overvoltage and undervoltage conditions, use a voltage regulator or a voltage supervisor to ensure that the input voltage (VIN) is within the recommended range of 2.7V to 5.5V. Additionally, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device.
  • The thermal shutdown temperature of the MAX44211ETP+T is typically around 150°C. If the device temperature exceeds this threshold, it will shut down to prevent damage.

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MAX44211ETP+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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