MAX4684EBC+ - Analog Devices

MAX4684EBC+ Details

• Manufacturer Part Number:

  MAX4684EBC+

• Brand Name:

  Analog Devices Inc

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  12-WLCSP-N/A

• Package Description:

  0.50 MM PITCH, UCSP-12

• Pin Count:

  12

• Manufacturer Package Code:

  12-WLCSP-N/A

• Country Of Origin:

  Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

• HTS Code:

  8542.39.00.60

• Date Of Intro:

  2001-01-03

• Manufacturer:

  Analog Devices Inc

• YTEOL:

  10

• Analog IC - Other Type:

  SPDT

• JESD-30 Code:

  R-PBGA-B12

• JESD-609 Code:

  e1

• Length:

  2.02 mm

• Moisture Sensitivity Level:

  1

• Number of Channels:

  1

• Number of Functions:

  2

• Number of Terminals:

  12

• Off-state Isolation-Nom:

  64 dB

• On-state Resistance Match-Nom:

  0.06 Ω

• On-state Resistance-Max (Ron):

  0.8 Ω

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output:

  SEPARATE OUTPUT

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA12,3X4,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.65 mm

• Signal Current-Max:

  0.3 A

• Supply Current-Max (Isup):

  0.0002 mA

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  1.8 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  YES

• Switch-off Time-Max:

  30 ns

• Switch-on Time-Max:

  50 ns

• Switching:

  BREAK-BEFORE-MAKE

• Technology:

  BICMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.52 mm