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MAX5530ETC+ - Analog Devices

Description: Maxim,MAX5530ETC+ Maxim MAX5530ETC+, 12 bit Serial DAC, 12-Pin TQFN

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Symbol
MAX5530ETC+ - Analog Devices - PCB symbol
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PCB Footprints
MAX5530ETC+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T1244+4
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3D Models
MAX5530ETC+ - Analog Devices - 3D model - Quad Flat No-Lead - T1244+4
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MAX5530ETC+ Details

  • Manufacturer Part Number:

    MAX5530ETC+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    12-LFCSP-4X4X0.75

  • Package Description:

    4 X 4 MM, 0.80 MM HEIGHT, MO-220, QFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    12-LFCSP-4X4X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2004-02-09

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N12

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC12,.16SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    660 µs

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAX5530ETC+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX5530ETC+ involves keeping the device close to the power supply, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. Additionally, it is recommended to place the device on the same layer as the power supply and to use a 4-layer PCB with a dedicated power plane.
  • To ensure the MAX5530ETC+ is properly powered up and initialized, make sure to follow the power-up sequence specified in the datasheet, which involves applying the power supply voltage (VCC) before the input voltage (VIN). Also, ensure that the input voltage is within the recommended operating range and that the device is properly bypassed with capacitors.
  • The maximum output current capability of the MAX5530ETC+ is 500mA. However, it is recommended to derate the output current based on the ambient temperature and the device's thermal characteristics to ensure reliable operation.
  • To optimize the performance of the MAX5530ETC+ in terms of noise and ripple, use a high-quality input capacitor with low ESR, and ensure that the output capacitor is properly sized and placed close to the device. Additionally, consider using a noise-reducing capacitor on the output and a ferrite bead on the input to further reduce noise and ripple.
  • The thermal shutdown temperature of the MAX5530ETC+ is typically around 150°C. When the device exceeds this temperature, it will shut down to prevent damage. However, it is recommended to design the system to operate within a safe temperature range to prevent thermal shutdown and ensure reliable operation.

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MAX5530ETC+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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