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MAX5584EUP+ - Analog Devices

Description: Buffered, Fast-Settling, Quad, 12-/10-/8-Bit, Voltage-Output DACs

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MAX5584EUP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U20E+1
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MAX5584EUP+ - Analog Devices  - 3D model - Small Outline Packages - U20E+1
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MAX5584EUP+ Details

  • Manufacturer Part Number:

    MAX5584EUP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-TSSOP_4.4_EP-4.4_MM

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-TSSOP_4.4_EP-4.4_MM

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2004-02-17

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.25 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    4 µs

  • Settling Time-Nom (tstl):

    2 µs

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX5584EUP+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX5584EUP+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals to minimize noise and interference.
  • The MAX5584EUP+ requires a single 2.7V to 5.5V power supply. It's recommended to power the device with a clean, low-noise power supply, and to ensure that the power supply is stable before applying any input signals. The power sequencing requirements are not critical, but it's recommended to power the device after the input signals are stable.
  • The MAX5584EUP+ can drive a maximum capacitive load of 100pF. Exceeding this limit may cause the device to oscillate or become unstable.
  • To troubleshoot issues with the MAX5584EUP+, start by checking the power supply and input signals for noise and stability. Verify that the device is properly powered and that the input signals are within the recommended range. Use an oscilloscope to check the output voltages and look for any signs of oscillation or instability. Check the PCB layout and ensure that it meets the recommended layout guidelines.
  • The MAX5584EUP+ is rated for operation up to 125°C, but its performance may degrade at high temperatures. The device's accuracy and linearity may be affected, and the output voltage may drift. It's recommended to derate the device's performance at high temperatures and to ensure that the device is properly cooled.

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MAX5584EUP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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