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MAX5722EUA+ - Analog Devices

Description: Maxim MAX5722EUA+, 2-channel 12 bit Serial DAC, 8-Pin μMAX

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MAX5722EUA+ - Analog Devices - PCB symbol
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MAX5722EUA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - umax-8
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MAX5722EUA+ - Analog Devices - 3D model - Small Outline Packages - umax-8
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MAX5722EUA+ Details

  • Manufacturer Part Number:

    MAX5722EUA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-MINI_SO-N/A

  • Package Description:

    5 X 3 MM, MO-187CAA, MICRO, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2001-07-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.3906%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    4 µs

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX5722EUA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX5722EUA+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended PCB layout, use a sufficient decoupling capacitor (at least 1uF), and keep the input and output impedance matched. Also, avoid using long input traces and keep the device away from noise sources.
  • The maximum power dissipation of the MAX5722EUA+ is dependent on the operating temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C. However, it's recommended to derate the power dissipation based on the operating temperature and the thermal resistance of the PCB.
  • The MAX5722EUA+ is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure proper heat sinking to maintain a safe operating temperature.
  • The MAX5722EUA+ has built-in overvoltage protection (OVP) and electrostatic discharge (ESD) protection. However, it's still recommended to add external protection devices such as TVS diodes or zener diodes to protect the device from high-voltage transients and ESD events.

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MAX5722EUA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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