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MAX5825BAUP+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX5825BAUP+ - DAC, 12BIT, OCTAL, TSSOP-20

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MAX5825BAUP+ - Analog Devices - PCB symbol
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PCB Footprints
MAX5825BAUP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 21-0066 (TSSOP20 4.4mm BODY)
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3D Models
MAX5825BAUP+ - Analog Devices - 3D model - Small Outline Packages - 21-0066 (TSSOP20 4.4mm BODY)
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MAX5825BAUP+ Details

  • Manufacturer Part Number:

    MAX5825BAUP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-TSSOP_4.4-4.4_MM

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2012-02-27

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    4.5 µs

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX5825BAUP+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX5825BAUP+ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to place the device near the power source and to use a low-ESR capacitor for the output filter.
  • To optimize the performance of the MAX5825BAUP+, you should consider factors such as the input voltage range, output voltage, and load current. You should also ensure that the device is operated within its recommended operating conditions, and that the input and output capacitors are properly selected. Additionally, you may need to adjust the compensation network to optimize the stability and transient response of the device.
  • The MAX5825BAUP+ has a maximum junction temperature of 150°C. To ensure reliable operation, you should ensure that the device is operated within its recommended operating conditions, and that the PCB is designed to provide adequate thermal dissipation. You may need to add thermal vias or heat sinks to the PCB to reduce the junction temperature.
  • To troubleshoot issues with the MAX5825BAUP+, you should start by checking the input voltage, output voltage, and load current. You should also verify that the device is operated within its recommended operating conditions, and that the input and output capacitors are properly selected. You can use oscilloscopes and other test equipment to measure the voltage and current waveforms, and to identify any issues with the device or the PCB.
  • The MAX5825BAUP+ is designed to meet the EMI and EMC requirements of most applications. However, you should still take steps to minimize EMI and EMC issues, such as using a shielded enclosure, adding EMI filters, and ensuring that the PCB is designed to minimize radiation. You should also ensure that the device is operated within its recommended operating conditions, and that the input and output capacitors are properly selected.

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MAX5825BAUP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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