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MAX6034AEXR25+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX6034AEXR25+T - Voltage Reference Series - Fixed, 2.5V reference, ± 7ppm/°C, SC-70-3

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MAX6034AEXR25+T - Analog Devices - PCB symbol
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PCB Footprints
MAX6034AEXR25+T - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 21-0075 REV.B
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MAX6034AEXR25+T - Analog Devices - 3D model - SOT23 (3-Pin) - 21-0075 REV.B
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MAX6034AEXR25+T Details

  • Manufacturer Part Number:

    MAX6034AEXR25+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    3-SC70-N/A

  • Package Description:

    TSOP, TSSOP3/6,.08

  • Pin Count:

    3

  • Manufacturer Package Code:

    3-SC70-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-05-22

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.505 V

  • Output Voltage-Min:

    2.495 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temp Coef of Voltage-Max:

    30 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.2%

  • Width:

    1.25 mm

MAX6034AEXR25+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX6034AEXR25+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB under the device, and to use a heat sink or thermal interface material (TIM) to dissipate heat. The device's thermal pad should be connected to a solid ground plane to help dissipate heat. Additionally, keeping the device away from other heat sources and using a well-ventilated enclosure can also help.
  • The recommended input capacitor value for the MAX6034AEXR25+T is 1uF to 10uF, with a low ESR (Equivalent Series Resistance) and a voltage rating of at least 25V. A ceramic or film capacitor is recommended, as they have low ESR and are suitable for high-frequency applications.
  • To troubleshoot issues with the MAX6034AEXR25+T, start by checking the input voltage and current, and ensuring that the device is properly powered. Next, check the output voltage and current, and verify that the output capacitor is properly sized and connected. If the issue persists, check for noise and EMI on the input and output lines, and ensure that the device is properly decoupled. Finally, consult the datasheet and application notes for guidance on specific troubleshooting steps.
  • The MAX6034AEXR25+T is rated for operation up to 125°C, but it's recommended to derate the device's output current and voltage at high temperatures to ensure reliable operation. Additionally, the device's thermal management should be carefully considered, and the device should be properly heat-sinked to prevent overheating.

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MAX6034AEXR25+T Overview

Use the download button to access the MAX6034AEXR25+T schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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