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MAX6071BAUT41+T - Analog Devices

Description: Voltage References Low-Noise, High-Precision Series Voltage References

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MAX6071BAUT41+T - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 21-0058
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MAX6071BAUT41+T - Analog Devices  - 3D model - SOT23 (6-Pin) - 21-0058
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MAX6071BAUT41+T Details

  • Manufacturer Part Number:

    MAX6071BAUT41+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    6-SOT_23-N/A

  • Pin Count:

    6

  • Manufacturer Package Code:

    6-SOT_23-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2012-11-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.01 A

  • Output Voltage-Max:

    4.0992768 V

  • Output Voltage-Min:

    4.0927232 V

  • Output Voltage-Nom:

    4.096 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.35 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    8 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.08%

  • Width:

    1.625 mm

MAX6071BAUT41+T Frequently Asked Questions (FAQs)

  • The thermal shutdown temperature of the MAX6071 is +165°C, as specified in the Absolute Maximum Ratings section of the datasheet.
  • The total error budget for the MAX6071 can be calculated by combining the individual errors due to voltage reference, gain error, and nonlinearity. Refer to the application notes and the 'Total Error Calculation' section in the datasheet for more information.
  • The MAX6071 is designed to operate with input voltages between 2.7V and 5.5V. While it may be possible to use it with a different input voltage range, it is not recommended as it may affect the accuracy and functionality of the device. Contact Analog Devices support for custom requirements.
  • The maximum output current of the MAX6071 is 10mA, as specified in the Electrical Characteristics section of the datasheet.
  • To minimize noise and ensure accuracy with the MAX6071, follow proper PCB layout guidelines such as separating analog and digital grounds, using separate power planes for the input and output, and keeping sensitive traces away from noisy components. Refer to the 'Layout Considerations' section in the datasheet for more information.

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MAX6071BAUT41+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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