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MAX6126A50+ - Analog Devices

Description: Maxim MAX6126A50+, Series Voltage Reference 5V, 0.06% 12.6 V max., 8-Pin μMAX

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MAX6126A50+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SO
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MAX6126A50+ - Analog Devices  - 3D model - Small Outline Packages - SO
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MAX6126A50+ Details

  • Manufacturer Part Number:

    MAX6126A50+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-MINI_SO-N/A

  • Package Description:

    UMAX-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-11-18

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.01 A

  • Output Voltage-Max:

    5.003 V

  • Output Voltage-Min:

    4.997 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    12.6 V

  • Supply Voltage-Min (Vsup):

    5.2 V

  • Supply Voltage-Nom (Vsup):

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temp Coef of Voltage-Max:

    5 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.06%

  • Width:

    3 mm

MAX6126A50+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX6126A50+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended PCB layout, use a sufficient decoupling capacitor (at least 10uF), and keep the input and output impedance matched. Also, avoid using long input traces and keep the device away from noise sources.
  • The MAX6126A50+ can handle input voltages up to 36V, but it's recommended to keep the input voltage below 30V to ensure reliable operation and to prevent damage to the device.
  • The MAX6126A50+ is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's recommended to derate the output current and voltage at high temperatures to ensure reliable operation.
  • To troubleshoot issues with the MAX6126A50+, start by checking the input voltage, output voltage, and output current. Use an oscilloscope to check for oscillations or noise on the output. Also, check the PCB layout and ensure that it follows the recommended layout guidelines.

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MAX6126A50+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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