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MAX6577ZUT+T - Analog Devices

Description: Maxim MAX6577ZUT+T Temperature Sensor 6-Pin SOT-23, -40 → +125 °C

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MAX6577ZUT+T - Analog Devices - PCB symbol
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PCB Footprints
MAX6577ZUT+T - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6 SOT23-6
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3D Models
MAX6577ZUT+T - Analog Devices - 3D model - SOT23 (6-Pin) - 6 SOT23-6
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MAX6577ZUT+T Details

  • Manufacturer Part Number:

    MAX6577ZUT+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    6-SOT_23-N/A

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    6-SOT_23-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • Date Of Intro:

    1999-04-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Accuracy-Max (Cel):

    5 Cel

  • Body Breadth:

    1.62 mm

  • Body Height:

    1.1 mm

  • Body Length or Diameter:

    2.9 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    6

  • Operating Current-Max:

    0.14 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    1-WIRE INTERFACE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Termination Type:

    SOLDER

MAX6577ZUT+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX6577ZUT+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB under the device, and to use a heat sink or thermal interface material (TIM) to dissipate heat. The device's thermal pad should be connected to a solid ground plane to help dissipate heat.
  • The recommended input capacitor value for the MAX6577ZUT+T is 10uF to 22uF, with a low ESR (Equivalent Series Resistance) and a voltage rating of at least 25V. A ceramic or film capacitor is recommended, as they have low ESR and are suitable for high-frequency applications.
  • To troubleshoot issues with the MAX6577ZUT+T, start by checking the input voltage and current, and ensure that the device is properly powered. Check the output voltage and current, and verify that the output capacitor value and type are correct. Use an oscilloscope to check for oscillation or ringing on the output, and ensure that the PCB layout is correct and follows the recommended layout guidelines.
  • Yes, the MAX6577ZUT+T is compatible with lead-free soldering processes, and is RoHS-compliant. However, it's recommended to follow the recommended soldering temperature profile and handling procedures to ensure reliable operation and to prevent damage to the device.

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MAX6577ZUT+T Overview

Use the download button to access the MAX6577ZUT+T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX65, or try a keyword search, such as Temperature Sensors

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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