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MAX7042ATJ+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX7042ATJ+ - IF RECEIVER, 300MHZ-450MHZ, TQFN-28

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Symbol
MAX7042ATJ+ - Analog Devices - PCB symbol
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PCB Footprints
MAX7042ATJ+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NS602408
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3D Models
MAX7042ATJ+ - Analog Devices - 3D model - Quad Flat No-Lead - NS602408
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MAX7042ATJ+ Details

  • Manufacturer Part Number:

    MAX7042ATJ+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    32-LFCSP-5X5X0.75

  • Package Description:

    5 X 5 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WHHD-2, TQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    32-LFCSP-5X5X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2005-06-02

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.0092 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX7042ATJ+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX7042ATJ+ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, the device should be placed near the power source to minimize voltage drops.
  • To ensure proper power-up and power-down of the MAX7042ATJ+, it is recommended to follow a controlled power-up sequence, where the input voltage (VIN) is applied before the enable pin (EN) is asserted. During power-down, the enable pin should be de-asserted before the input voltage is removed. This helps prevent unwanted voltage transients and ensures proper device operation.
  • The maximum allowed voltage on the EN pin of the MAX7042ATJ+ is 6V. Exceeding this voltage can cause damage to the device. It is recommended to use a voltage limiter or a voltage divider to ensure the EN pin voltage does not exceed 6V.
  • During power-up, the WDT should be reset by asserting the WDT reset pin (WDTRST) low for at least 100ns. During power-down, the WDT should be disabled by asserting the WDT disable pin (WDTDIS) high. This helps prevent unwanted resets and ensures proper device operation.
  • The recommended operating temperature range for the MAX7042ATJ+ is -40°C to +125°C. Operating the device outside this range can affect its performance and reliability.

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MAX7042ATJ+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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