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MAX77650BEWV+T - Analog Devices

Description: Ultra-Low Power PMIC with 3-Output SIMO and Power Path Charger for Small Li+

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MAX77650BEWV+T - Analog Devices - PCB symbol
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PCB Footprints
MAX77650BEWV+T - Analog Devices PCB footprint - BGA - BGA - W302H2+1
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3D Models
MAX77650BEWV+T - Analog Devices - 3D model - BGA - W302H2+1
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MAX77650BEWV+T Details

  • Manufacturer Part Number:

    MAX77650BEWV+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    30-WLCSP-N/A

  • Pin Count:

    30

  • Manufacturer Package Code:

    30-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2016-07-22

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Time@Peak Reflow Temperature-Max (s):

    30

MAX77650BEWV+T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX77650BEWV+T can be found in the MAX77650 Evaluation Kit documentation, which provides a detailed layout guide and Gerber files for reference. Additionally, Analog Devices provides a PCB layout checklist in the datasheet to ensure proper layout and thermal management.
  • To optimize the performance of the MAX77650BEWV+T, it's essential to follow the recommended layout and thermal management guidelines. Additionally, Analog Devices provides an evaluation kit and software tools, such as the MAX77650EVKIT and the Maxim PowerTool, to help engineers optimize the device's performance and configure its settings for their specific application.
  • The MAX77650BEWV+T has a high-power density, so proper thermal management is crucial. The device has an exposed pad that must be connected to a thermal pad on the PCB, and the PCB should be designed to dissipate heat efficiently. The datasheet provides thermal resistance and junction-to-case thermal resistance values to help engineers design an effective thermal management system.
  • Analog Devices provides a troubleshooting guide in the datasheet, which covers common issues and their solutions. Additionally, the MAX77650EVKIT and Maxim PowerTool software can be used to debug and troubleshoot the device. Engineers can also contact Analog Devices' technical support team for further assistance.
  • The MAX77650BEWV+T is designed to meet EMI and EMC requirements, but proper PCB layout and design are still essential to minimize electromagnetic interference. The datasheet provides guidelines for EMI and EMC considerations, and engineers should follow best practices for PCB design, such as using shielding, filtering, and proper grounding.

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MAX77650BEWV+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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