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MAX77958EWV+ - Analog Devices

Description: Standalone USB Type-C and USB Power Delivery Controller

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MAX77958EWV+ - Analog Devices PCB footprint - BGA - BGA - MAX77958EWV+
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MAX77958EWV+ - Analog Devices  - 3D model - BGA - MAX77958EWV+
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MAX77958EWV+ Details

  • Manufacturer Part Number:

    MAX77958EWV+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    30-WLCSP-N/A

  • Package Description:

    WLP-30

  • Pin Count:

    30

  • Manufacturer Package Code:

    30-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-05-14

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B30

  • Length:

    3.068 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA30,5X6,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    2.6 V

  • Supply Voltage-Nom (Vsup):

    4.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +2.5V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.618 mm

MAX77958EWV+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX77958EWV+ can be found in the MAX77958EWV+ Evaluation Kit User Guide (UG-1143) provided by Analog Devices Inc. It includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The MAX77958EWV+ can be configured for different battery chemistries by adjusting the battery profile settings through the I2C interface. The specific configuration settings can be found in the MAX77958EWV+ datasheet and application notes. Additionally, Analog Devices Inc provides a battery profile configuration tool to simplify the process.
  • The MAX77958EWV+ can support up to 3A of charging current, but the actual maximum current depends on the specific application and thermal design. It's recommended to consult the datasheet and thermal design guidelines to ensure safe and reliable operation.
  • Yes, the MAX77958EWV+ can be used in a multi-cell battery configuration. It supports up to 4 series cells and provides individual cell monitoring and balancing. However, the specific configuration and design requirements may vary depending on the application, and it's recommended to consult the datasheet and application notes for more information.
  • The MAX77958EWV+ has built-in overcharge and over-discharge protection features that can be configured through the I2C interface. It monitors the battery voltage and current, and can detect and respond to abnormal conditions to prevent damage to the battery and the system.

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MAX77958EWV+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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