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MAX803MEXR+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX803MEXR+T - Supervisor, Active-Low, Open-Drain Reset, 1.2V-5.5Vin, SC-70-3

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MAX803MEXR+T - Analog Devices - PCB symbol
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PCB Footprints
MAX803MEXR+T - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - X3+2
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3D Models
MAX803MEXR+T - Analog Devices - 3D model - SOT23 (3-Pin) - X3+2
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MAX803MEXR+T Details

  • Manufacturer Part Number:

    MAX803MEXR+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    3-SC70-N/A

  • Package Description:

    TSSOP, TSSOP3/6,.08

  • Pin Count:

    3

  • Manufacturer Package Code:

    3-SC70-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-05-10

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    MNL RST:N;PW FL IO:N;PRG RST DLY:N;WD:N;WDO:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.38V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

MAX803MEXR+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX803MEXR+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power-up and initialization, make sure to follow the power-up sequence recommended in the datasheet. Apply the input voltage (VIN) before the enable signal (EN). The EN pin should be driven high after VIN has reached its nominal value. Also, ensure that the input voltage is within the recommended operating range and that the device is properly decoupled with capacitors.
  • The maximum current that the MAX803MEXR+T can deliver depends on the input voltage, output voltage, and package thermal resistance. The datasheet provides a formula to calculate the maximum output current (IOUT) based on these parameters. Typically, the device can deliver up to 3A of output current, but this value may be limited by the input voltage, output voltage, and thermal considerations.
  • Thermal management is critical for the MAX803MEXR+T, especially in high-power applications. Ensure good airflow around the device, and consider using a heat sink or thermal pad to improve heat dissipation. The datasheet provides thermal resistance values for the package, which can be used to estimate the junction temperature. Monitor the device temperature and adjust the design accordingly to prevent overheating.
  • To minimize EMI and EMC issues with the MAX803MEXR+T, follow proper PCB layout guidelines, use shielding, and add EMI filters as needed. Ensure that the device is properly decoupled, and use a common-mode choke or ferrite bead to reduce high-frequency noise. Additionally, consider using a spread-spectrum clock or frequency hopping to reduce EMI emissions.

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MAX803MEXR+T Overview

Use the download button to access the MAX803MEXR+T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX80, or try a keyword search, such as Power Management Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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