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MAX810SQ463T1G - onsemi

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PCB Footprints
MAX810SQ463T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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3D Models
MAX810SQ463T1G - onsemi  - 3D model - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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MAX810SQ463T1G Details

  • Manufacturer Part Number:

    MAX810SQ463T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.1 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    SOT-323

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.0025 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.63V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.24 mm

MAX810SQ463T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX810SQ463T1G involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation over the entire operating temperature range, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and avoiding thermal hotspots. Additionally, ensure that the device is operated within its specified voltage and current limits.
  • Not using the recommended bypass capacitors can lead to instability, noise, and reduced performance. The bypass capacitors help to filter out high-frequency noise and ensure that the device operates within its specified voltage range. Omitting them can result in reduced output voltage accuracy, increased noise, and potential device failure.
  • Yes, the MAX810SQ463T1G is suitable for high-reliability and automotive applications. It's built with high-quality materials and has undergone rigorous testing to ensure its reliability and performance. However, it's essential to follow proper design and manufacturing practices, such as using a qualified manufacturing process, and ensuring that the device is operated within its specified limits.
  • To troubleshoot issues with the MAX810SQ463T1G, start by verifying that the device is properly powered and that the input and output voltages are within the specified ranges. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use oscilloscopes and other diagnostic tools to identify any noise or signal integrity issues. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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MAX810SQ463T1G Overview

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