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MAX8212CPA+ - Analog Devices

Description: MAX8212CPA+, Voltage Supervisor 1.11 V Microprocessor Voltage Monitor 8-Pin PDIP N

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MAX8212CPA+ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - MAX8212CPA
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MAX8212CPA+ Details

  • Manufacturer Part Number:

    MAX8212CPA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-PDIP-300_MIL

  • Package Description:

    PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-PDIP-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1999-05-26

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.375 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Supply Current-Max (Isup):

    0.02 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.62 mm

MAX8212CPA+ Frequently Asked Questions (FAQs)

  • The MAX8212CPA+ is a high-frequency device, and proper layout and placement are crucial for optimal performance. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the power supply.
  • The MAX8212CPA+ requires a specific bias voltage and current to operate optimally. Ensure that the VCC pin is connected to a stable voltage source between 2.7V and 5.5V, and that the ISET pin is connected to a resistor that sets the desired output current. Refer to the datasheet for specific biasing requirements.
  • The MAX8212CPA+ is rated for operation from -40°C to +125°C. However, the device's performance may degrade at extreme temperatures, and it is recommended to operate within the specified temperature range for optimal performance.
  • Yes, the MAX8212CPA+ is suitable for high-reliability and automotive applications. It is manufactured using a high-reliability process and is qualified to AEC-Q100 standards. However, it is recommended to consult with Analog Devices Inc. for specific requirements and qualifications.
  • When troubleshooting issues with the MAX8212CPA+, start by verifying the power supply and biasing conditions. Check for proper voltage and current levels, and ensure that the device is properly connected to the load. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet for troubleshooting guidelines.

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MAX8212CPA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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