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MAX9064EBS+TG45 - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX9064EBS+TG45 - Analogue Comparator, Ultra Small, Low Power, 1 Comparator, 15 µs, -0.3V to 5.5V, 1V to 5.5V, UCSP

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MAX9064EBS+TG45 - Analog Devices PCB footprint - BGA - BGA - B4+1
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MAX9064EBS+TG45 - Analog Devices  - 3D model - BGA - B4+1
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MAX9064EBS+TG45 Details

  • Manufacturer Part Number:

    MAX9064EBS+TG45

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    4-WLCSP-N/A

  • Package Description:

    UCSP-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    4-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2008-05-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.015 µA

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    S-PBGA-B4

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA4,2X2,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    15000 ns

  • Supply Current-Max:

    0.0011 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

MAX9064EBS+TG45 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MAX9064EBS+TG45 near the thermal source, using a thermal pad or heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and thermal vias can also help to dissipate heat efficiently.
  • Calibration of the MAX9064EBS+TG45 involves trimming the internal offset and gain registers to compensate for manufacturing variations. This can be done using the device's built-in calibration registers or through external calibration using a precision temperature source and a microcontroller.
  • The MAX9064EBS+TG45 can operate over a temperature range of -40°C to +150°C, but the accuracy of the temperature measurement may degrade at extreme temperatures. It's recommended to operate the device within the specified temperature range for optimal performance.
  • To handle noise and EMI, use proper PCB layout techniques, such as separating analog and digital signals, using shielding, and adding filtering components like capacitors and resistors. Additionally, consider using a differential signal pair and a common-mode filter to reject noise and EMI.
  • Yes, the MAX9064EBS+TG45 is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress and damage. Additionally, consider using a vibration-resistant PCB material and design.

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MAX9064EBS+TG45 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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