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MAX96717GTJ/VY+ - Analog Devices

Description: SERIALIZER, 2.5GBPS, SWTQFN-EP-32 ROHS COMPLIANT: YES

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MAX96717GTJ/VY+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-LFCSP_SS-5X5X0.75_2023
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MAX96717GTJ/VY+ - Analog Devices  - 3D model - Quad Flat No-Lead - 32-LFCSP_SS-5X5X0.75_2023
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MAX96717GTJ/VY+ Details

  • Manufacturer Part Number:

    MAX96717GTJ/VY+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    32-LFCSP_SS-5X5X0.75

  • Package Description:

    TQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    32-LFCSP_SS-5X5X0.75

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2023-04-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    SERIALIZER

  • Interface Standard:

    GMSL

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.6 V

  • Output Characteristics:

    OPEN-DRAIN

  • Output Low Current-Max:

    0.004 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100; ISO 26262-ASIL B

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    238 mA

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX96717GTJ/VY+ Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the MAX96717GTJ/VY+. Ensure a solid ground plane, keep the input and output traces separate, and use a common mode choke to reduce EMI. Refer to the application note AN-2153 for a detailed layout guide.
  • The MAX96717GTJ/VY+ requires configuration for the specific camera module used. Refer to the camera module's datasheet for the recommended configuration. You may need to adjust the clock frequency, data format, and other settings to match the camera module's requirements.
  • The MAX96717GTJ/VY+ supports cable lengths up to 10 meters (33 feet) at a data rate of 1 Gbps. However, the actual cable length may vary depending on the cable quality, signal integrity, and system noise.
  • The MAX96717GTJ/VY+ is designed for CMOS camera modules. While it may be possible to use it with a non-CMOS camera module, it's not recommended as it may not provide optimal performance or compatibility. Check the camera module's datasheet for compatibility information.
  • To troubleshoot issues with the MAX96717GTJ/VY+, start by checking the power supply, clock signal, and data transmission. Use an oscilloscope to verify the signal integrity and check for errors. Refer to the datasheet and application notes for troubleshooting guides and FAQs.

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MAX96717GTJ/VY+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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