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MAX98355AEWL+T - Analog Devices

Description: PCM Input Class D Audio Power Amplifiers

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MAX98355AEWL+T - Analog Devices - PCB symbol
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MAX98355AEWL+T - Analog Devices PCB footprint - BGA - BGA - 9 WLP
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MAX98355AEWL+T - Analog Devices - 3D model - BGA - 9 WLP
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MAX98355AEWL+T Details

  • Manufacturer Part Number:

    MAX98355AEWL+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    9-WLCSP-N/A

  • Package Description:

    WLP-9

  • Pin Count:

    9

  • Manufacturer Package Code:

    9-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2012-06-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    15 dB

  • JESD-30 Code:

    R-PBGA-B9

  • Length:

    1.435 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3.2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.345 mm

MAX98355AEWL+T Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for optimal performance. Ensure that the audio signal traces are short and away from noise sources, and that the power supply decoupling capacitors are placed close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Refer to the application note AN-2153 for more details.
  • To optimize for low power consumption, ensure that the device is operated at the lowest possible supply voltage (1.5V), and that the shutdown mode is used when not in use. Additionally, adjust the gain settings and clock frequency to minimize power consumption. Refer to the datasheet section 7.1 for more details.
  • The recommended clock frequency for the I2S interface is 256fs, 384fs, or 512fs, where fs is the sample frequency. However, the device can operate with other clock frequencies as well. Ensure that the clock frequency is within the specified range and that it meets the system requirements.
  • To troubleshoot audio artifacts or distortion, check the PCB layout for noise coupling, ensure that the power supply is clean and well-regulated, and verify that the device is operated within the specified temperature range. Also, check the audio signal integrity and ensure that it is not clipped or over-driven. Refer to the application note AN-2153 for more details.
  • The device has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. Ensure that the thermal plane is connected to a heat sink or a metal plate to dissipate heat efficiently. Refer to the datasheet section 7.2 for more details.

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MAX98355AEWL+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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