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MAXM15066AMB+ - Analog Devices

Description: Switching Voltage Regulators For MAXM17904: 4.5V to 24V Input, 3.3V, 300mA Output, Integrated Inductor, Compact Step-Do

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MAXM15066AMB+ - Analog Devices PCB footprint - Other - Other - MAXM15066AMB+-2
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MAXM15066AMB+ - Analog Devices  - 3D model - Other - MAXM15066AMB+-2
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MAXM15066AMB+ Details

  • Manufacturer Part Number:

    MAXM15066AMB+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    10-CSP_BGA_EM-3X2.6X1.5

  • Package Description:

    USLIC-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    10-CSP_BGA_EM-3X2.6X1.5

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-07-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PWM/PFM

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PDSO-N10

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.3 A

  • Output Voltage-Max:

    5.25 V

  • Output Voltage-Min:

    4.75 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSON

  • Package Equivalence Code:

    SOLCC10,.1,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Seated Height-Max:

    1.65 mm

  • Supply Current-Max (Isup):

    0.16 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    585 kHz

  • Technology:

    HYBRID

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2.6 mm

MAXM15066AMB+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAXM15066AMB+ involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, connect the EN pin to a valid logic level, and configure the device using the SPI interface. Also, make sure to follow the recommended voltage and current ratings for the device.
  • The MAXM15066AMB+ has a maximum junction temperature of 150°C. To manage thermal performance, use a heat sink or thermal pad, ensure good airflow, and avoid blocking the thermal pads on the device. Also, follow the recommended thermal design guidelines in the datasheet.
  • To troubleshoot issues with the MAXM15066AMB+, start by checking the power supply and configuration, then verify the SPI interface communication. Use a logic analyzer or oscilloscope to debug the device's behavior. Also, consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, the MAXM15066AMB+ is a high-frequency device and requires proper EMI/EMC design considerations. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Follow the recommended layout and design guidelines in the datasheet and application notes.

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MAXM15066AMB+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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